BOND LAB Trademark

Trademark Overview


On Thursday, June 1, 2000, a trademark application was filed for BOND LAB with the United States Patent and Trademark Office. The USPTO has given the BOND LAB trademark a serial number of 76058924. The federal status of this trademark filing is CANCELLED - SECTION 8 as of Friday, December 17, 2010. This trademark is owned by BondPro Laboratories, LLC. The BOND LAB trademark is filed in the Treatment & Processing of Materials Services and Computer & Software Services & Scientific Services categories with the following description:

Custom manufacture of adhesives

Adhesive testing and adhesive process development
bond lab

General Information


Serial Number76058924
Word MarkBOND LAB
Filing DateThursday, June 1, 2000
Status710 - CANCELLED - SECTION 8
Status DateFriday, December 17, 2010
Registration Number2841869
Registration DateTuesday, May 11, 2004
Mark Drawing1000 - Typeset: Word(s) / letter(s) / number(s)
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Disclaimer with Predetermined Text"LAB"
Goods and ServicesCustom manufacture of adhesives
Goods and ServicesAdhesive testing and adhesive process development

Classification Information


International Class040 - Treatment of materials.
US Class Codes100, 103, 106
Class Status Code2 - Sec. 8 - Entire Registration
Class Status DateFriday, December 17, 2010
Primary Code040
First Use Anywhere DateThursday, November 15, 2001
First Use In Commerce DateThursday, November 15, 2001

International Class042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software.
US Class Codes100, 101
Class Status Code2 - Sec. 8 - Entire Registration
Class Status DateFriday, December 17, 2010
Primary Code042
First Use Anywhere DateThursday, November 15, 2001
First Use In Commerce DateThursday, November 15, 2001

Trademark Owner History


Party NameBONDPLEX, LLC
Party Type30 - Original Registrant
Legal Entity Type16 - Limited Liability Company
AddressHUDSON, WI 54016

Party NameBONDPLEX, LLC
Party Type11 - New Owner Before Publication
Legal Entity Type16 - Limited Liability Company
AddressHUDSON, WI 54016

Party NameBondPro Laboratories, LLC
Party Type10 - Original Applicant
Legal Entity Type99 - Other
AddressHudson, WI 54016

Trademark Events


Event DateEvent Description
Friday, December 17, 2010CANCELLED SEC. 8 (6-YR)
Monday, May 4, 2009ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
Monday, May 4, 2009TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
Tuesday, May 11, 2004REGISTERED-SUPPLEMENTAL REGISTER
Thursday, February 19, 2004APPROVED FOR REGISTRATION SUPPLEMENTAL REGISTER
Thursday, February 19, 2004USE AMENDMENT ACCEPTED
Tuesday, June 17, 2003CORRESPONDENCE RECEIVED IN LAW OFFICE
Wednesday, January 28, 2004CASE FILE IN TICRS
Tuesday, June 17, 2003FAX RECEIVED
Wednesday, May 28, 2003ACTION DENYING REQ FOR RECON MAILED
Wednesday, March 26, 2003CORRESPONDENCE RECEIVED IN LAW OFFICE
Wednesday, March 26, 2003TEAS RESPONSE TO OFFICE ACTION RECEIVED
Thursday, February 27, 2003CONTINUATION OF FINAL REFUSAL MAILED
Thursday, December 19, 2002CORRESPONDENCE RECEIVED IN LAW OFFICE
Thursday, December 19, 2002TEAS CHANGE OF CORRESPONDENCE RECEIVED
Thursday, December 19, 2002TEAS RESPONSE TO OFFICE ACTION RECEIVED
Monday, December 16, 2002TEAS CHANGE OF CORRESPONDENCE RECEIVED
Tuesday, October 29, 2002ASSIGNED TO EXAMINER
Friday, August 23, 2002NON-FINAL ACTION MAILED
Tuesday, March 26, 2002AMENDMENT TO USE PROCESSING COMPLETE
Monday, March 25, 2002IU INFORMAL RESPONSE RECEIVED
Monday, February 11, 2002CORRESPONDENCE RECEIVED IN LAW OFFICE
Monday, March 18, 2002USE AFFIDAVIT FAILED FORMALITIES
Tuesday, February 5, 2002USE AMENDMENT FILED
Friday, February 8, 2002CORRESPONDENCE RECEIVED IN LAW OFFICE
Wednesday, December 5, 2001FINAL REFUSAL MAILED
Friday, May 18, 2001CORRESPONDENCE RECEIVED IN LAW OFFICE
Monday, November 20, 2000NON-FINAL ACTION MAILED
Friday, November 3, 2000ASSIGNED TO EXAMINER