BAIL MONEY BAIL BONDS Trademark

Trademark Overview


On Monday, July 20, 2015, a trademark application was filed for BAIL MONEY BAIL BONDS with the United States Patent and Trademark Office. The USPTO has given the BAIL MONEY BAIL BONDS trademark a serial number of 86698199. The federal status of this trademark filing is ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE as of Monday, June 6, 2016. The BAIL MONEY BAIL BONDS trademark is filed in the Insurance & Financial Services category with the following description:

Bail bonding
bail money bail bonds

General Information


Serial Number86698199
Word MarkBAIL MONEY BAIL BONDS
Filing DateMonday, July 20, 2015
Status602 - ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE
Status DateMonday, June 6, 2016
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4000 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Goods and ServicesBail bonding

Classification Information


International Class036 - Insurance; financial affairs; monetary affairs; real estate affairs.
US Class Codes100, 101, 102
Class Status Code6 - Active
Class Status DateFriday, July 24, 2015
Primary Code036
First Use Anywhere DateTuesday, March 31, 2009
First Use In Commerce DateTuesday, March 31, 2009

Trademark Owner History


Party NameNOT AVAILABLE
Party Type10 - Original Applicant
Legal Entity Type01 - Individual
AddressManchester, CT 06042

Trademark Events


Event DateEvent Description
Monday, June 6, 2016ABANDONMENT NOTICE MAILED - FAILURE TO RESPOND
Monday, June 6, 2016ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE
Friday, October 30, 2015NOTIFICATION OF NON-FINAL ACTION E-MAILED
Friday, October 30, 2015NON-FINAL ACTION E-MAILED
Friday, October 30, 2015NON-FINAL ACTION WRITTEN
Thursday, October 29, 2015ASSIGNED TO EXAMINER
Friday, July 24, 2015NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM
Thursday, July 23, 2015NEW APPLICATION ENTERED IN TRAM

Related Keywords


bail bonds money bonding