AOR TCB Trademark

Trademark Overview

On Wednesday, October 9, 2024, a trademark application was filed for AOR TCB with the United States Patent and Trademark Office. The USPTO has given the AOR TCB trademark a serial number of 98792857. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Wednesday, October 9, 2024. This trademark is owned by ASMPT Singapore Pte. Ltd.. The AOR TCB trademark is filed in the Machinery Products category with the following description:

Machines for assembly of semiconductor components; bonding equipment, namely, die bonders for semiconductor processing; semiconductor bonding machines.
aor tcb

General Information

Serial Number98792857
Word MarkAOR TCB
Filing DateWednesday, October 9, 2024
Status630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
Status DateWednesday, October 9, 2024
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements

Goods and ServicesMachines for assembly of semiconductor components; bonding equipment, namely, die bonders for semiconductor processing; semiconductor bonding machines.

Classification Information

International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 024, 031, 034, 035
Class Status Code6 - Active
Class Status DateWednesday, October 9, 2024
Primary Code007
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History

Party NameASMPT Singapore Pte. Ltd.
Party Type10 - Original Applicant
Legal Entity Type24 - NOT AVAILABLE
AddressSingapore 768924
SG

Trademark Events

Event DateEvent Description
Wednesday, October 9, 2024NEW APPLICATION ENTERED

Related Keywords

semiconductor machines bonding bonders processing namely equipment assembly components