ALPHA HITECH Trademark

Trademark Overview

On Wednesday, December 19, 2018, a trademark application was filed for ALPHA HITECH with the United States Patent and Trademark Office. The USPTO has given the ALPHA HITECH trademark a serial number of 88235671. The federal status of this trademark filing is REGISTERED as of Tuesday, August 9, 2022. This trademark is owned by Alpha Assembly Solutions Inc.. The ALPHA HITECH trademark is filed in the Chemical Products category with the following description:

adhesives for use in electronics industry; non-conductive adhesives for use in electronics industry; unprocessed epoxy resins for use in electronics industry; industrial adhesives used in the assembly, maintenance and repair of electronics for use in electronics industry; fillers for use with electronic components, namely, unprocessed epoxy resins for use as underfill; unprocessed epoxy resins; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, and unprocessed epoxy resins for bonding, wetproofing, coating, encapsulation, sealing, molding, waterproofing, moisture proofing, heatproofing, solder joint attachment applications in the electronics industry; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, and unprocessed epoxy resins for use in the electronics industry
alpha hitech

General Information

Serial Number88235671
Word MarkALPHA HITECH
Filing DateWednesday, December 19, 2018
Status700 - REGISTERED
Status DateTuesday, August 9, 2022
Registration Number6815403
Registration DateTuesday, August 9, 2022
Mark Drawing4000 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, May 5, 2020

Trademark Statements

Pseudo MarkALPHA HI TECH
Goods and Servicesadhesives for use in electronics industry; non-conductive adhesives for use in electronics industry; unprocessed epoxy resins for use in electronics industry; industrial adhesives used in the assembly, maintenance and repair of electronics for use in electronics industry; fillers for use with electronic components, namely, unprocessed epoxy resins for use as underfill; unprocessed epoxy resins; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, and unprocessed epoxy resins for bonding, wetproofing, coating, encapsulation, sealing, molding, waterproofing, moisture proofing, heatproofing, solder joint attachment applications in the electronics industry; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, and unprocessed epoxy resins for use in the electronics industry
Disclaimer with Predetermined Text"HIGH TECH"

Classification Information

International Class001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
US Class Codes001, 005, 006, 010, 026, 046
Class Status Code6 - Active
Class Status DateFriday, January 11, 2019
Primary Code001
First Use Anywhere DateSaturday, January 1, 2022
First Use In Commerce DateSaturday, January 1, 2022

Trademark Owner History

Party NameAlpha Assembly Solutions Inc.
Party Type30 - Original Registrant
Legal Entity Type03 - Corporation
AddressWaterbury, CT 06702
Party NameAlpha Assembly Solutions Inc.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressWaterbury, CT 06702
Party NameAlpha Assembly Solutions Inc.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressSomerset, NJ 08873

Trademark Events

Event DateEvent Description
Tuesday, August 9, 2022NOTICE OF REGISTRATION CONFIRMATION EMAILED
Tuesday, August 9, 2022REGISTERED-PRINCIPAL REGISTER
Saturday, July 2, 2022NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED
Saturday, July 2, 2022NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Friday, July 1, 2022ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
Friday, July 1, 2022STATEMENT OF USE PROCESSING COMPLETE
Wednesday, June 29, 2022USE AMENDMENT FILED
Friday, July 1, 2022SOU EXTENSION 4 GRANTED
Wednesday, June 29, 2022SOU EXTENSION 4 FILED
Wednesday, June 29, 2022TEAS EXTENSION RECEIVED
Wednesday, June 29, 2022TEAS STATEMENT OF USE RECEIVED
Wednesday, January 5, 2022NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Tuesday, January 4, 2022SOU EXTENSION 3 GRANTED
Monday, December 27, 2021SOU EXTENSION 3 FILED
Tuesday, January 4, 2022CASE ASSIGNED TO INTENT TO USE PARALEGAL
Monday, December 27, 2021TEAS EXTENSION RECEIVED
Tuesday, June 29, 2021NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Friday, June 25, 2021SOU EXTENSION 2 GRANTED
Friday, June 25, 2021SOU EXTENSION 2 FILED
Friday, June 25, 2021TEAS EXTENSION RECEIVED
Monday, March 1, 2021APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED
Monday, March 1, 2021TEAS CHANGE OF CORRESPONDENCE RECEIVED
Monday, March 1, 2021ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
Monday, March 1, 2021TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
Monday, March 1, 2021TEAS CHANGE OF OWNER ADDRESS RECEIVED
Wednesday, December 23, 2020NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Monday, December 21, 2020SOU EXTENSION 1 GRANTED
Monday, December 21, 2020SOU EXTENSION 1 FILED
Monday, December 21, 2020TEAS EXTENSION RECEIVED
Tuesday, June 30, 2020NOA E-MAILED - SOU REQUIRED FROM APPLICANT
Tuesday, May 5, 2020OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Tuesday, May 5, 2020PUBLISHED FOR OPPOSITION
Wednesday, April 15, 2020NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Monday, March 30, 2020ASSIGNED TO LIE
Tuesday, March 24, 2020APPROVED FOR PUB - PRINCIPAL REGISTER
Thursday, March 19, 2020TEAS/EMAIL CORRESPONDENCE ENTERED
Wednesday, March 18, 2020CORRESPONDENCE RECEIVED IN LAW OFFICE
Wednesday, March 18, 2020TEAS REQUEST FOR RECONSIDERATION RECEIVED
Thursday, October 17, 2019NOTIFICATION OF FINAL REFUSAL EMAILED
Thursday, October 17, 2019FINAL REFUSAL E-MAILED
Thursday, October 17, 2019FINAL REFUSAL WRITTEN
Wednesday, September 25, 2019TEAS/EMAIL CORRESPONDENCE ENTERED
Wednesday, September 25, 2019CORRESPONDENCE RECEIVED IN LAW OFFICE
Wednesday, September 25, 2019TEAS RESPONSE TO OFFICE ACTION RECEIVED
Monday, March 25, 2019NOTIFICATION OF NON-FINAL ACTION E-MAILED
Monday, March 25, 2019NON-FINAL ACTION E-MAILED
Monday, March 25, 2019NON-FINAL ACTION WRITTEN
Thursday, March 14, 2019ASSIGNED TO EXAMINER
Friday, January 11, 2019NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM
Saturday, December 22, 2018NEW APPLICATION ENTERED IN TRAM

Related Keywords

hitech alpha unprocessed resins electronics industry epoxy adhesives industrial artificial synthetic molding