ALPHA-FRY TECHNOLOGIES Trademark

Trademark Overview


On Thursday, May 25, 2000, a trademark application was filed for ALPHA-FRY TECHNOLOGIES with the United States Patent and Trademark Office. The USPTO has given the ALPHA-FRY TECHNOLOGIES trademark a serial number of 76057743. The federal status of this trademark filing is CANCELLED - SECTION 8 as of Friday, July 20, 2012. This trademark is owned by Fry's Metals, Inc.. The ALPHA-FRY TECHNOLOGIES trademark is filed in the Chemical Products, Cosmetics & Cleaning Products, and Metal Products categories with the following description:

CHEMICALS FOR USE IN THE MANUFACTURE AND ASSEMBLY OF PRINTED CIRCUITS, ELECTRONIC COMPONENTS AND SEMICONDUCTOR PACKAGES; CHEMICAL COMPOUNDS, NAMELY, RESIN COATINGS USED AS TEMPORARY SOLDER MASKS TO PREVENT THE ADHERENCE OF SOLDER TO BASE METAL FOR USE IN THE PRINTED CIRCUIT BOARD INDUSTRY; THERMOPLASTIC PASTE ADHESIVES FOR USE IN THE MANUFACTURE OF ELECTRONIC ASSEMBLIES; SOLDERING CHEMICALS, NAMELY, AQUEOUS MACHINE DESCALERS FOR USE IN THE PRINTED CIRCUIT BOARD INDUSTRY; SOLDER CHEMICALS AND ANTIOXIDANTS FOR USE WITH SOLDER; CHEMICAL PREPARATIONS IN THE NATURE OF RUST INHIBITORS; SOLDERING FLUX; WATER SOLUBLE SOLDERING FLUX; LOW SOLIDS SOLDER FLUX; SOLDERING FLUX, ZINC CHLORIDE TYPE; SOLDER CHEMICALS AND ANTIOXIDANTS FOR USE WITH SOLDER; FLUXES USED FOR SOLDERING ELECTRONIC CIRCUITS, WHICH DO NOT REQUIRE CLEANING AFTER SAID USE; OXIDATION CHEMICALS FOR PROTECTING THE SURFACE TO WHICH THEY ARE APPLIED FOR USE IN CONNECTION WITH SOLDER; SILVER/GLASS DIE ATTACH MATERIAL ADHESIVES FOR USE ...

ORGANIC SOLVENTS FOR CLEANING AND DEGREASING PRINTED CIRCUIT BOARDS; SOLDERING AND PRINTED CIRCUIT CHEMICALS, NAMELY, ALKALI CLEANERS, DEGREASING SOLVENTS, FLUX REMOVER, METAL CLEANER, PAINT STRIPPERS AND VARNISH REMOVER, WIRE STRIPPING PREPARATION FOR REMOVING INSULATION FROM METAL, SILK SCREEN INK REMOVER, SOLDER RESIST REMOVING PREPARATION; SOLVENT AND AQUEOUS CLEANERS TO REMOVE RESIDUES AND CONTAMINANTS BEFORE AND AFTER SOLDERING; CHEMICAL CLEANER AND ROSIN FLUX REMOVER FOR USE IN ROSIN MILDLY ACTIVATED PASTE APPLICATIONS, NAMELY, CLEANING COMPOUND FOR SOLDER PLATED PRINTED CIRCUITS

TIN AND LEAD EUTECTIC SOLDER; WATER SOLUBLE ORGANIC FLUX CORED SOLDER WIRE; COATED METAL STRIP; SOLDERS COMPOSED PRIMARILY OF LEAD AND TIN; DISPENSER FILLED WITH WIRE SOLDER; BAR, WIRE AND CORE SOLDER; LASER CUT METAL STENCILS FOR USE IN THE ASSEMBLY OF ELECTRONIC COMPONENTS; SOLDER METAL ALLOY THAT IS TREATED TO INHIBIT DROSS FORMATION AND INCREASE FLUIDITY FOR USE IN SOLDERING APPLICATIONS; PASTES CONTAINING METAL POWDER FOR USE IN COPPER BRAZING; FLUX CORED WIRE SOLDER FOR USE IN THE ELECTRONICS INDUSTRY
alpha-fry technologies

General Information


Serial Number76057743
Word MarkALPHA-FRY TECHNOLOGIES
Filing DateThursday, May 25, 2000
Status710 - CANCELLED - SECTION 8
Status DateFriday, July 20, 2012
Registration Number3029558
Registration DateTuesday, December 13, 2005
Mark Drawing1000 - Typeset: Word(s) / letter(s) / number(s)
Published for Opposition DateTuesday, June 4, 2002

Trademark Statements


Disclaimer with Predetermined Text"TECHNOLOGIES"
Goods and ServicesCHEMICALS FOR USE IN THE MANUFACTURE AND ASSEMBLY OF PRINTED CIRCUITS, ELECTRONIC COMPONENTS AND SEMICONDUCTOR PACKAGES; CHEMICAL COMPOUNDS, NAMELY, RESIN COATINGS USED AS TEMPORARY SOLDER MASKS TO PREVENT THE ADHERENCE OF SOLDER TO BASE METAL FOR USE IN THE PRINTED CIRCUIT BOARD INDUSTRY; THERMOPLASTIC PASTE ADHESIVES FOR USE IN THE MANUFACTURE OF ELECTRONIC ASSEMBLIES; SOLDERING CHEMICALS, NAMELY, AQUEOUS MACHINE DESCALERS FOR USE IN THE PRINTED CIRCUIT BOARD INDUSTRY; SOLDER CHEMICALS AND ANTIOXIDANTS FOR USE WITH SOLDER; CHEMICAL PREPARATIONS IN THE NATURE OF RUST INHIBITORS; SOLDERING FLUX; WATER SOLUBLE SOLDERING FLUX; LOW SOLIDS SOLDER FLUX; SOLDERING FLUX, ZINC CHLORIDE TYPE; SOLDER CHEMICALS AND ANTIOXIDANTS FOR USE WITH SOLDER; FLUXES USED FOR SOLDERING ELECTRONIC CIRCUITS, WHICH DO NOT REQUIRE CLEANING AFTER SAID USE; OXIDATION CHEMICALS FOR PROTECTING THE SURFACE TO WHICH THEY ARE APPLIED FOR USE IN CONNECTION WITH SOLDER; SILVER/GLASS DIE ATTACH MATERIAL ADHESIVES FOR USE IN SILICON CHIP BINDING; CHEMICAL PREPARATIONS FOR SOLDERING, NAMELY, SOLDERING INJECTION CHEMICALS TO REDUCE OXIDE FORMATION ON BRIDGE CONDUCTION LINES, SURFACE CONDITIONING CHEMICALS TO PREPARE SURFACES FOR SOLDERING; PROTECTIVE CHEMICAL COATINGS TO MAINTAIN SOLDERABILITY OF SURFACES; ULTRAVIOLET CURABLE POLYMERS FOR USE IN LEGEND INKS, SOLDER MASKS AND ETCHING/PLATING RESISTS; SOLDERING CHEMICALS, NAMELY, AQUEOUS RESIST STRIPPER FOR USE IN THE PRINTED CIRCUIT BOARD INDUSTRY
Goods and ServicesORGANIC SOLVENTS FOR CLEANING AND DEGREASING PRINTED CIRCUIT BOARDS; SOLDERING AND PRINTED CIRCUIT CHEMICALS, NAMELY, ALKALI CLEANERS, DEGREASING SOLVENTS, FLUX REMOVER, METAL CLEANER, PAINT STRIPPERS AND VARNISH REMOVER, WIRE STRIPPING PREPARATION FOR REMOVING INSULATION FROM METAL, SILK SCREEN INK REMOVER, SOLDER RESIST REMOVING PREPARATION; SOLVENT AND AQUEOUS CLEANERS TO REMOVE RESIDUES AND CONTAMINANTS BEFORE AND AFTER SOLDERING; CHEMICAL CLEANER AND ROSIN FLUX REMOVER FOR USE IN ROSIN MILDLY ACTIVATED PASTE APPLICATIONS, NAMELY, CLEANING COMPOUND FOR SOLDER PLATED PRINTED CIRCUITS
Goods and ServicesTIN AND LEAD EUTECTIC SOLDER; WATER SOLUBLE ORGANIC FLUX CORED SOLDER WIRE; COATED METAL STRIP; SOLDERS COMPOSED PRIMARILY OF LEAD AND TIN; DISPENSER FILLED WITH WIRE SOLDER; BAR, WIRE AND CORE SOLDER; LASER CUT METAL STENCILS FOR USE IN THE ASSEMBLY OF ELECTRONIC COMPONENTS; SOLDER METAL ALLOY THAT IS TREATED TO INHIBIT DROSS FORMATION AND INCREASE FLUIDITY FOR USE IN SOLDERING APPLICATIONS; PASTES CONTAINING METAL POWDER FOR USE IN COPPER BRAZING; FLUX CORED WIRE SOLDER FOR USE IN THE ELECTRONICS INDUSTRY

Classification Information


International Class001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
US Class Codes001, 005, 006, 010, 026, 046
Class Status Code2 - Sec. 8 - Entire Registration
Class Status DateFriday, July 20, 2012
Primary Code001
First Use Anywhere DateWednesday, December 31, 1997
First Use In Commerce DateWednesday, December 31, 1997

International Class003 - Bleaching preparations and other substances for laundry use; cleaning, polishing, scouring and abrasive preparations; soaps; perfumery, essential oils, cosmetics, hair lotions; dentifrices.
US Class Codes001, 004, 006, 050, 051, 052
Class Status Code2 - Sec. 8 - Entire Registration
Class Status DateFriday, July 20, 2012
Primary Code003
First Use Anywhere DateWednesday, December 31, 1997
First Use In Commerce DateWednesday, December 31, 1997

International Class006 - Common metals and their alloys; metal building materials; transportable buildings of metal; materials of metal for railway tracks; nonelectric cables and wires of common metal; ironmongery, small items of metal hardware; pipes and tubes of metal; safes; goods of common metal not included in other classes; ores.
US Class Codes002, 012, 013, 014, 023, 025, 050
Class Status Code2 - Sec. 8 - Entire Registration
Class Status DateFriday, July 20, 2012
Primary Code006
First Use Anywhere DateWednesday, December 31, 1997
First Use In Commerce DateWednesday, December 31, 1997

Trademark Owner History


Party NameFry's Metals, Inc.
Party Type30 - Original Registrant
Legal Entity Type03 - Corporation
AddressJERSEY CITY, NJ 07304

Party NameFry's Metals, Inc.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressJERSEY CITY, NJ 07304

Party NameFry's Metals, Inc.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressProvidence, RI 02903

Trademark Events


Event DateEvent Description
Friday, July 20, 2012CANCELLED SEC. 8 (6-YR)
Tuesday, December 13, 2005REGISTERED-PRINCIPAL REGISTER
Tuesday, November 1, 2005LAW OFFICE REGISTRATION REVIEW COMPLETED
Friday, October 28, 2005ASSIGNED TO LIE
Tuesday, October 25, 2005ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
Tuesday, September 13, 2005STATEMENT OF USE PROCESSING COMPLETE
Friday, August 26, 2005USE AMENDMENT FILED
Tuesday, August 30, 2005PAPER RECEIVED
Monday, January 24, 2005EXTENSION 5 GRANTED
Thursday, January 6, 2005EXTENSION 5 FILED
Thursday, January 6, 2005TEAS EXTENSION RECEIVED
Thursday, October 28, 2004EXTENSION 4 GRANTED
Sunday, August 22, 2004EXTENSION 4 FILED
Thursday, July 29, 2004CASE FILE IN TICRS
Thursday, July 22, 2004TEAS EXTENSION RECEIVED
Tuesday, March 2, 2004EXTENSION 3 GRANTED
Monday, February 23, 2004EXTENSION 3 FILED
Monday, February 23, 2004TEAS EXTENSION RECEIVED
Monday, August 11, 2003EXTENSION 2 GRANTED
Monday, August 11, 2003EXTENSION 2 FILED
Monday, August 11, 2003PAPER RECEIVED
Thursday, February 20, 2003EXTENSION 1 GRANTED
Thursday, February 20, 2003EXTENSION 1 FILED
Tuesday, February 25, 2003PAPER RECEIVED
Tuesday, August 27, 2002NOA MAILED - SOU REQUIRED FROM APPLICANT
Tuesday, June 4, 2002PUBLISHED FOR OPPOSITION
Wednesday, May 15, 2002NOTICE OF PUBLICATION
Wednesday, November 21, 2001APPROVED FOR PUB - PRINCIPAL REGISTER
Monday, November 19, 2001EXAMINERS AMENDMENT MAILED
Monday, May 21, 2001CORRESPONDENCE RECEIVED IN LAW OFFICE
Monday, November 20, 2000NON-FINAL ACTION MAILED
Wednesday, November 15, 2000ASSIGNED TO EXAMINER
Wednesday, November 1, 2000ASSIGNED TO EXAMINER
Friday, October 20, 2000ASSIGNED TO EXAMINER