Serial Number | 79070214 |
Word Mark | ALCSP |
Filing Date | Monday, December 22, 2008 |
Status | 404 - IR CANCELLED - US REGISTRATION CANCELLED |
Status Date | Sunday, December 23, 2018 |
Registration Number | 3856878 |
Registration Date | Tuesday, October 5, 2010 |
Mark Drawing | 5000 - Drawing with word(s) / letter(s) / number(s) in Stylized form |
Published for Opposition Date | Tuesday, July 20, 2010 |
Indication of Colors claimed | Color is not claimed as a feature of the mark. |
Goods and Services | Semiconductor devices; semiconductor chips; integrated circuits; integrated circuit chips, namely, integrated circuit chips for use in electronic integrated circuits; integrated circuit chips for use in circuit boards; integrated circuit chips for use in integrated circuit cards; integrated circuit chips for use in integrated circuit modules; integrated circuit chips for use as a component of computers, computer workstations, server computers, personal computers, computer peripheral equipment, digital appliances, digital consumer electronic devices, digital home electrical appliances, mobile computers, video game consoles, home video game machines, mechatronic devices, electronic business equipment, electronic industrial instruments, office automation equipment, computer networking hardware, automobile electronic in-car devices, vehicle equipment, sensors, integrated circuit cards, point-of-sale terminals, printers, hard disk drives, digital audio-visual equipment, digital televisions, digital audio players, digital still cameras, optical and magneto-optical disc players and records digital video cameras, DVD recorder/players, HDD recorders, telephones, fax machines, mobile phones, car audio equipment, car navigation computers, and personal navigation computers; integrated circuit modules; integrated circuit packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); semiconductor memory; dynamic random access memory; semiconductor memory units; dynamic random access memory modules; electronic circuits; large scale integrated circuits; semiconductor wafers; integrated circuit (IC) memories, namely, semi-conductor memory units for integrated circuits; computer software for designing of integrated circuits |
Goods and Services | Assembly of products for others, namely, semiconductor devices and semiconductor device packages consisting of semiconductor devices, semiconductor memory devices and integrated circuits; manufacturing and assembling for others in the field of integrated circuits and integrated circuit packages consisting of semiconductor devices, semiconductor memory devices and integrated circuits; manufacturing and assembling of semi-conductors and integrated circuits for others; manufacturing and assembling of semi-conductors for others; manufacturing and assembling of structured semiconductor wafers for others; providing information about manufacturing services for others in the field of semiconductors; providing information about manufacturing services for others in the field of semiconductor power elements; providing information about manufacturing services for others in the field of integrated circuits; providing information about manufacturing services for others in the field of structured semiconductor wafers |
Goods and Services | Design for others in the field of semiconductor device packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); design for others in the field of integrated circuit (IC) packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); design for others in the field of semiconductor devices, integrated circuits, semiconductor memory, dynamic random access memory, and semiconductor device packages and integrated circuit (IC) packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); testing, inspection or research on semiconductor power elements, semiconductor devices, integrated circuits, semiconductor memory, dynamic random access memory, and semiconductor device packages and integrated circuit (IC) packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); design for others in the field of integrated circuits; design for others in the field of semi-conductors, semiconductor power elements and integrated circuits; providing on-line non-downloadable computer programs for designing of processing technology, processing devices and electric circuit modeling of integrated circuits, namely, software for use in the design and manufacture of integrated circuits; providing information about product development and design for others in the field of semiconductor integrated circuits; providing information about inspection of semi-conductors; providing information about designing of semi-conductors for others; advisory and consultancy services relating to the designing of integrated circuits for others; product research and development and design for others in the field of semiconductor elements, integrated circuit and electronic circuits, advisory, consultancy and information services relating to product research and development and design for others in the field of semiconductor elements, integrated circuits and electronic circuits |
Pseudo Mark | A L C S P |
International Class | 009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus. |
US Class Codes | 021, 023, 026, 036, 038 |
Class Status Code | F - NOT AVAILABLE |
Class Status Date | Friday, May 12, 2017 |
Primary Code | 009 |
First Use Anywhere Date | NOT AVAILABLE |
First Use In Commerce Date | NOT AVAILABLE |
International Class | 040 - Treatment of materials. |
US Class Codes | 100, 103, 106 |
Class Status Code | F - NOT AVAILABLE |
Class Status Date | Friday, May 12, 2017 |
Primary Code | 040 |
First Use Anywhere Date | NOT AVAILABLE |
First Use In Commerce Date | NOT AVAILABLE |
International Class | 042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software. |
US Class Codes | 100, 101 |
Class Status Code | F - NOT AVAILABLE |
Class Status Date | Friday, May 12, 2017 |
Primary Code | 042 |
First Use Anywhere Date | NOT AVAILABLE |
First Use In Commerce Date | NOT AVAILABLE |
Party Name | Elpida Memory, Inc. |
Party Type | 30 - Original Registrant |
Legal Entity Type | 03 - Corporation |
Address | Tokyo 104-0028 JP |
Party Name | Elpida Memory, Inc. |
Party Type | 20 - Owner at Publication |
Legal Entity Type | 03 - Corporation |
Address | JP |
Party Name | Elpida Memory, Inc. |
Party Type | 10 - Original Applicant |
Legal Entity Type | 03 - Corporation |
Address | JP |
Event Date | Event Description |
Friday, July 12, 2019 | NOTIFICATION OF EFFECT OF CANCELLATION OF INTL REG E-MAILED |
Friday, July 12, 2019 | DEATH OF INTERNATIONAL REGISTRATION |
Friday, February 23, 2018 | TOTAL INVALIDATION PROCESSED BY THE IB |
Wednesday, January 24, 2018 | TOTAL INVALIDATION OF REG EXT PROTECTION SENT TO IB |
Wednesday, January 24, 2018 | INVALIDATION PROCESSED |
Friday, January 12, 2018 | TOTAL INVALIDATION OF REG EXT PROTECTION CREATED |
Friday, May 12, 2017 | CANCELLED SECTION 71 |
Monday, October 5, 2015 | COURTESY REMINDER - SEC. 71 (6-YR) E-MAILED |
Wednesday, February 11, 2015 | TEAS CHANGE OF CORRESPONDENCE RECEIVED |
Tuesday, February 12, 2013 | FINAL DECISION TRANSACTION PROCESSED BY IB |
Monday, January 10, 2011 | FINAL DISPOSITION NOTICE SENT TO IB |
Thursday, January 6, 2011 | FINAL DISPOSITION PROCESSED |
Wednesday, January 5, 2011 | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB |
Tuesday, October 5, 2010 | REGISTERED-PRINCIPAL REGISTER |
Tuesday, July 20, 2010 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
Tuesday, July 20, 2010 | PUBLISHED FOR OPPOSITION |
Tuesday, June 15, 2010 | LAW OFFICE PUBLICATION REVIEW COMPLETED |
Monday, June 14, 2010 | APPROVED FOR PUB - PRINCIPAL REGISTER |
Tuesday, June 8, 2010 | TEAS/EMAIL CORRESPONDENCE ENTERED |
Tuesday, June 8, 2010 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
Tuesday, June 8, 2010 | TEAS REQUEST FOR RECONSIDERATION RECEIVED |
Friday, March 26, 2010 | NOTIFICATION OF FINAL REFUSAL EMAILED |
Friday, March 26, 2010 | FINAL REFUSAL E-MAILED |
Friday, March 26, 2010 | FINAL REFUSAL WRITTEN |
Wednesday, March 3, 2010 | TEAS/EMAIL CORRESPONDENCE ENTERED |
Wednesday, March 3, 2010 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
Wednesday, March 3, 2010 | ASSIGNED TO LIE |
Friday, February 5, 2010 | TEAS CHANGE OF CORRESPONDENCE RECEIVED |
Friday, February 5, 2010 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
Friday, September 4, 2009 | REFUSAL PROCESSED BY IB |
Friday, August 7, 2009 | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB |
Thursday, August 6, 2009 | REFUSAL PROCESSED BY MPU |
Thursday, August 6, 2009 | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW |
Wednesday, August 5, 2009 | NON-FINAL ACTION WRITTEN |
Friday, July 31, 2009 | APPLICATION FILING RECEIPT MAILED |
Monday, July 27, 2009 | ASSIGNED TO EXAMINER |
Monday, July 27, 2009 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM |
Friday, July 24, 2009 | LIMITATION OF GOODS/SERVICES FROM IB ENTERED |
Thursday, July 23, 2009 | SN ASSIGNED FOR SECT 66A APPL FROM IB |