ALCSP Trademark

Trademark Overview


On Monday, December 22, 2008, a trademark application was filed for ALCSP with the United States Patent and Trademark Office. The USPTO has given the ALCSP trademark a serial number of 79070214. The federal status of this trademark filing is IR CANCELLED - US REGISTRATION CANCELLED as of Sunday, December 23, 2018. This trademark is owned by Elpida Memory, Inc.. The ALCSP trademark is filed in the Computer & Software Products & Electrical & Scientific Products, Treatment & Processing of Materials Services, and Computer & Software Services & Scientific Services categories with the following description:

Semiconductor devices; semiconductor chips; integrated circuits; integrated circuit chips, namely, integrated circuit chips for use in electronic integrated circuits; integrated circuit chips for use in circuit boards; integrated circuit chips for use in integrated circuit cards; integrated circuit chips for use in integrated circuit modules; integrated circuit chips for use as a component of computers, computer workstations, server computers, personal computers, computer peripheral equipment, digital appliances, digital consumer electronic devices, digital home electrical appliances, mobile computers, video game consoles, home video game machines, mechatronic devices, electronic business equipment, electronic industrial instruments, office automation equipment, computer networking hardware, automobile electronic in-car devices, vehicle equipment, sensors, integrated circuit cards, point-of-sale terminals, printers, hard disk drives, digital audio-visual equipment, digital televisions,...

Assembly of products for others, namely, semiconductor devices and semiconductor device packages consisting of semiconductor devices, semiconductor memory devices and integrated circuits; manufacturing and assembling for others in the field of integrated circuits and integrated circuit packages consisting of semiconductor devices, semiconductor memory devices and integrated circuits; manufacturing and assembling of semi-conductors and integrated circuits for others; manufacturing and assembling of semi-conductors for others; manufacturing and assembling of structured semiconductor wafers for others; providing information about manufacturing services for others in the field of semiconductors; providing information about manufacturing services for others in the field of semiconductor power elements; providing information about manufacturing services for others in the field of integrated circuits; providing information about manufacturing services for others in the field of structured sem...

Design for others in the field of semiconductor device packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); design for others in the field of integrated circuit (IC) packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); design for others in the field of semiconductor devices, integrated circuits, semiconductor memory, dynamic random access memory, and semiconductor device packages and integrated circuit (IC) packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); testing, inspection or research on semiconductor power elements, semiconductor devices, integrated circuits, semiconductor memory, dynamic random access memory, and semiconductor device packages and integrated circuit (IC...
alcsp

General Information


Serial Number79070214
Word MarkALCSP
Filing DateMonday, December 22, 2008
Status404 - IR CANCELLED - US REGISTRATION CANCELLED
Status DateSunday, December 23, 2018
Registration Number3856878
Registration DateTuesday, October 5, 2010
Mark Drawing5000 - Drawing with word(s) / letter(s) / number(s) in Stylized form
Published for Opposition DateTuesday, July 20, 2010

Trademark Statements


Indication of Colors claimedColor is not claimed as a feature of the mark.
Goods and ServicesSemiconductor devices; semiconductor chips; integrated circuits; integrated circuit chips, namely, integrated circuit chips for use in electronic integrated circuits; integrated circuit chips for use in circuit boards; integrated circuit chips for use in integrated circuit cards; integrated circuit chips for use in integrated circuit modules; integrated circuit chips for use as a component of computers, computer workstations, server computers, personal computers, computer peripheral equipment, digital appliances, digital consumer electronic devices, digital home electrical appliances, mobile computers, video game consoles, home video game machines, mechatronic devices, electronic business equipment, electronic industrial instruments, office automation equipment, computer networking hardware, automobile electronic in-car devices, vehicle equipment, sensors, integrated circuit cards, point-of-sale terminals, printers, hard disk drives, digital audio-visual equipment, digital televisions, digital audio players, digital still cameras, optical and magneto-optical disc players and records digital video cameras, DVD recorder/players, HDD recorders, telephones, fax machines, mobile phones, car audio equipment, car navigation computers, and personal navigation computers; integrated circuit modules; integrated circuit packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); semiconductor memory; dynamic random access memory; semiconductor memory units; dynamic random access memory modules; electronic circuits; large scale integrated circuits; semiconductor wafers; integrated circuit (IC) memories, namely, semi-conductor memory units for integrated circuits; computer software for designing of integrated circuits
Goods and ServicesAssembly of products for others, namely, semiconductor devices and semiconductor device packages consisting of semiconductor devices, semiconductor memory devices and integrated circuits; manufacturing and assembling for others in the field of integrated circuits and integrated circuit packages consisting of semiconductor devices, semiconductor memory devices and integrated circuits; manufacturing and assembling of semi-conductors and integrated circuits for others; manufacturing and assembling of semi-conductors for others; manufacturing and assembling of structured semiconductor wafers for others; providing information about manufacturing services for others in the field of semiconductors; providing information about manufacturing services for others in the field of semiconductor power elements; providing information about manufacturing services for others in the field of integrated circuits; providing information about manufacturing services for others in the field of structured semiconductor wafers
Goods and ServicesDesign for others in the field of semiconductor device packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); design for others in the field of integrated circuit (IC) packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); design for others in the field of semiconductor devices, integrated circuits, semiconductor memory, dynamic random access memory, and semiconductor device packages and integrated circuit (IC) packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); testing, inspection or research on semiconductor power elements, semiconductor devices, integrated circuits, semiconductor memory, dynamic random access memory, and semiconductor device packages and integrated circuit (IC) packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); design for others in the field of integrated circuits; design for others in the field of semi-conductors, semiconductor power elements and integrated circuits; providing on-line non-downloadable computer programs for designing of processing technology, processing devices and electric circuit modeling of integrated circuits, namely, software for use in the design and manufacture of integrated circuits; providing information about product development and design for others in the field of semiconductor integrated circuits; providing information about inspection of semi-conductors; providing information about designing of semi-conductors for others; advisory and consultancy services relating to the designing of integrated circuits for others; product research and development and design for others in the field of semiconductor elements, integrated circuit and electronic circuits, advisory, consultancy and information services relating to product research and development and design for others in the field of semiconductor elements, integrated circuits and electronic circuits
Pseudo MarkA L C S P

Classification Information


International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status CodeF - NOT AVAILABLE
Class Status DateFriday, May 12, 2017
Primary Code009
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class040 - Treatment of materials.
US Class Codes100, 103, 106
Class Status CodeF - NOT AVAILABLE
Class Status DateFriday, May 12, 2017
Primary Code040
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software.
US Class Codes100, 101
Class Status CodeF - NOT AVAILABLE
Class Status DateFriday, May 12, 2017
Primary Code042
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameElpida Memory, Inc.
Party Type30 - Original Registrant
Legal Entity Type03 - Corporation
AddressTokyo 104-0028
JP

Party NameElpida Memory, Inc.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressJP

Party NameElpida Memory, Inc.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressJP

Trademark Events


Event DateEvent Description
Friday, July 12, 2019NOTIFICATION OF EFFECT OF CANCELLATION OF INTL REG E-MAILED
Friday, July 12, 2019DEATH OF INTERNATIONAL REGISTRATION
Friday, February 23, 2018TOTAL INVALIDATION PROCESSED BY THE IB
Wednesday, January 24, 2018TOTAL INVALIDATION OF REG EXT PROTECTION SENT TO IB
Wednesday, January 24, 2018INVALIDATION PROCESSED
Friday, January 12, 2018TOTAL INVALIDATION OF REG EXT PROTECTION CREATED
Friday, May 12, 2017CANCELLED SECTION 71
Monday, October 5, 2015COURTESY REMINDER - SEC. 71 (6-YR) E-MAILED
Wednesday, February 11, 2015TEAS CHANGE OF CORRESPONDENCE RECEIVED
Tuesday, February 12, 2013FINAL DECISION TRANSACTION PROCESSED BY IB
Monday, January 10, 2011FINAL DISPOSITION NOTICE SENT TO IB
Thursday, January 6, 2011FINAL DISPOSITION PROCESSED
Wednesday, January 5, 2011FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
Tuesday, October 5, 2010REGISTERED-PRINCIPAL REGISTER
Tuesday, July 20, 2010OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Tuesday, July 20, 2010PUBLISHED FOR OPPOSITION
Tuesday, June 15, 2010LAW OFFICE PUBLICATION REVIEW COMPLETED
Monday, June 14, 2010APPROVED FOR PUB - PRINCIPAL REGISTER
Tuesday, June 8, 2010TEAS/EMAIL CORRESPONDENCE ENTERED
Tuesday, June 8, 2010CORRESPONDENCE RECEIVED IN LAW OFFICE
Tuesday, June 8, 2010TEAS REQUEST FOR RECONSIDERATION RECEIVED
Friday, March 26, 2010NOTIFICATION OF FINAL REFUSAL EMAILED
Friday, March 26, 2010FINAL REFUSAL E-MAILED
Friday, March 26, 2010FINAL REFUSAL WRITTEN
Wednesday, March 3, 2010TEAS/EMAIL CORRESPONDENCE ENTERED
Wednesday, March 3, 2010CORRESPONDENCE RECEIVED IN LAW OFFICE
Wednesday, March 3, 2010ASSIGNED TO LIE
Friday, February 5, 2010TEAS CHANGE OF CORRESPONDENCE RECEIVED
Friday, February 5, 2010TEAS RESPONSE TO OFFICE ACTION RECEIVED
Friday, September 4, 2009REFUSAL PROCESSED BY IB
Friday, August 7, 2009NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
Thursday, August 6, 2009REFUSAL PROCESSED BY MPU
Thursday, August 6, 2009NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
Wednesday, August 5, 2009NON-FINAL ACTION WRITTEN
Friday, July 31, 2009APPLICATION FILING RECEIPT MAILED
Monday, July 27, 2009ASSIGNED TO EXAMINER
Monday, July 27, 2009NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM
Friday, July 24, 2009LIMITATION OF GOODS/SERVICES FROM IB ENTERED
Thursday, July 23, 2009SN ASSIGNED FOR SECT 66A APPL FROM IB