AI POWER Trademark

Trademark Overview

On Thursday, September 3, 2020, a trademark application was filed for AI POWER with the United States Patent and Trademark Office. The USPTO has given the AI POWER trademark a serial number of 90156569. The federal status of this trademark filing is SU - REGISTRATION REVIEW COMPLETE as of Friday, March 15, 2024. This trademark is owned by ASM Technology Singapore Pte Ltd. The AI POWER trademark is filed in the Machinery Products category with the following description:

Machines for laser processing of semiconductor wafers; Machines for assembly of semiconductor components; Bonding apparatus, namely, machines for bonding semiconductor components and other electronic devices; Wire bonding machines; Electronics industry equipment, namely, machines for processing, assembly, and packaging electronic components; Apparatus for semiconductor wafer handling, namely, semiconductor wafer processing equipment and machines; Machines for semiconductor wafer processing; Machines for printed circuit board processing
ai power

General Information

Serial Number90156569
Word MarkAI POWER
Filing DateThursday, September 3, 2020
Status819 - SU - REGISTRATION REVIEW COMPLETE
Status DateFriday, March 15, 2024
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing3000 - Illustration: Drawing or design which also includes word(s) / letter(s) / number(s)
Published for Opposition DateTuesday, June 27, 2023

Trademark Statements

Description of MarkThe mark consists of the letters "Ai" appearing above the word "POWER" all of which appear in a stylized font with a stylized circle design appearing diagonally from the lower left of the mark to the upper right.
Goods and ServicesMachines for laser processing of semiconductor wafers; Machines for assembly of semiconductor components; Bonding apparatus, namely, machines for bonding semiconductor components and other electronic devices; Wire bonding machines; Electronics industry equipment, namely, machines for processing, assembly, and packaging electronic components; Apparatus for semiconductor wafer handling, namely, semiconductor wafer processing equipment and machines; Machines for semiconductor wafer processing; Machines for printed circuit board processing
Disclaimer with Predetermined Text"POWER"

Classification Information

International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 024, 031, 034, 035
Class Status Code6 - Active
Class Status DateWednesday, May 24, 2023
Primary Code007
First Use Anywhere DateSaturday, October 31, 2020
First Use In Commerce DateSaturday, October 31, 2020

Trademark Owner History

Party NameASMPT SINGAPORE PTE. LTD.
Party Type20 - Owner at Publication
Legal Entity Type24 - NOT AVAILABLE
AddressSINGAPORE 768924
SG
Party NameASMPT SINGAPORE PTE. LTD.
Party Type11 - New Owner Before Publication
Legal Entity Type24 - NOT AVAILABLE
AddressSINGAPORE 768924
SG
Party NameASM Technology Singapore Pte Ltd
Party Type10 - Original Applicant
Legal Entity Type99 - Other
AddressSingapore 768924
SG

Trademark Events

Event DateEvent Description
Saturday, March 16, 2024NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED
Friday, March 15, 2024ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
Thursday, March 14, 2024STATEMENT OF USE PROCESSING COMPLETE
Thursday, February 22, 2024USE AMENDMENT FILED
Thursday, March 14, 2024CASE ASSIGNED TO INTENT TO USE PARALEGAL
Thursday, February 22, 2024TEAS STATEMENT OF USE RECEIVED
Tuesday, August 22, 2023NOA E-MAILED - SOU REQUIRED FROM APPLICANT
Tuesday, June 27, 2023OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Tuesday, June 27, 2023PUBLISHED FOR OPPOSITION
Wednesday, June 7, 2023NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Wednesday, May 24, 2023APPROVED FOR PUB - PRINCIPAL REGISTER
Wednesday, May 24, 2023EXAMINER'S AMENDMENT ENTERED
Wednesday, May 24, 2023NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
Wednesday, May 24, 2023EXAMINERS AMENDMENT E-MAILED
Wednesday, May 24, 2023EXAMINERS AMENDMENT -WRITTEN
Thursday, May 18, 2023TEAS/EMAIL CORRESPONDENCE ENTERED
Wednesday, May 17, 2023CORRESPONDENCE RECEIVED IN LAW OFFICE
Wednesday, May 17, 2023TEAS REQUEST FOR RECONSIDERATION RECEIVED
Wednesday, May 17, 2023APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED
Wednesday, May 17, 2023TEAS CHANGE OF CORRESPONDENCE RECEIVED
Wednesday, May 17, 2023TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS
Wednesday, May 17, 2023TEAS WITHDRAWAL OF ATTORNEY RECEIVED-FIRM RETAINS
Wednesday, May 17, 2023ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
Wednesday, May 17, 2023TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
Wednesday, May 17, 2023TEAS CHANGE OF OWNER ADDRESS RECEIVED
Thursday, February 23, 2023SUSPENSION CHECKED - TO ATTORNEY FOR ACTION
Tuesday, February 21, 2023NOTIFICATION OF FINAL REFUSAL EMAILED
Tuesday, February 21, 2023FINAL REFUSAL E-MAILED
Tuesday, February 21, 2023FINAL REFUSAL WRITTEN
Wednesday, October 12, 2022AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
Monday, July 18, 2022REPORT COMPLETED SUSPENSION CHECK CASE STILL SUSPENDED
Tuesday, January 18, 2022REPORT COMPLETED SUSPENSION CHECK CASE STILL SUSPENDED
Wednesday, July 14, 2021NOTIFICATION OF LETTER OF SUSPENSION E-MAILED
Wednesday, July 14, 2021LETTER OF SUSPENSION E-MAILED
Wednesday, July 14, 2021SUSPENSION LETTER WRITTEN
Tuesday, July 13, 2021TEAS/EMAIL CORRESPONDENCE ENTERED
Monday, July 12, 2021CORRESPONDENCE RECEIVED IN LAW OFFICE
Monday, July 12, 2021TEAS RESPONSE TO OFFICE ACTION RECEIVED
Monday, January 11, 2021NOTIFICATION OF NON-FINAL ACTION E-MAILED
Monday, January 11, 2021NON-FINAL ACTION E-MAILED
Monday, January 11, 2021NON-FINAL ACTION WRITTEN
Monday, January 11, 2021ASSIGNED TO EXAMINER
Friday, October 9, 2020NOTICE OF DESIGN SEARCH CODE E-MAILED
Thursday, October 8, 2020NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Monday, September 7, 2020NEW APPLICATION ENTERED

Related Keywords

power machines semiconductor processing components wafer bonding namely equipment electronic apparatus