ACUITY Trademark

Trademark Overview

On Monday, August 1, 2022, a trademark application was filed for ACUITY with the United States Patent and Trademark Office. The USPTO has given the ACUITY trademark a serial number of 97529110. The federal status of this trademark filing is REGISTERED as of Tuesday, August 27, 2024. This trademark is owned by Applied Materials, Inc.. The ACUITY trademark is filed in the Machinery Products category with the following description:

Semiconductor wafer processing equipment and semiconductor wafer processing equipment components, namely, on-board metrology system for measuring thickness of incoming seed layer and plated material, and post-plating cleanliness of wafer bevel
acuity

General Information

Serial Number97529110
Word MarkACUITY
Filing DateMonday, August 1, 2022
Status700 - REGISTERED
Status DateTuesday, August 27, 2024
Registration Number7489674
Registration DateTuesday, August 27, 2024
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, April 4, 2023

Trademark Statements

Goods and ServicesSemiconductor wafer processing equipment and semiconductor wafer processing equipment components, namely, on-board metrology system for measuring thickness of incoming seed layer and plated material, and post-plating cleanliness of wafer bevel

Classification Information

International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 024, 031, 034, 035
Class Status Code6 - Active
Class Status DateFriday, August 5, 2022
Primary Code007
First Use Anywhere DateTuesday, November 7, 2023
First Use In Commerce DateTuesday, November 7, 2023

Trademark Owner History

Party NameApplied Materials, Inc.
Party Type30 - Original Registrant
Legal Entity Type03 - Corporation
AddressSanta Clara, CA 95054
Party NameApplied Materials, Inc.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressSanta Clara, CA 95054
Party NameApplied Materials, Inc.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressSanta Clara, CA 95054

Trademark Events

Event DateEvent Description
Friday, August 5, 2022NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Thursday, August 4, 2022NEW APPLICATION ENTERED
Friday, February 24, 2023ASSIGNED TO EXAMINER
Wednesday, March 1, 2023APPROVED FOR PUB - PRINCIPAL REGISTER
Wednesday, March 15, 2023NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Tuesday, April 4, 2023PUBLISHED FOR OPPOSITION
Tuesday, April 4, 2023OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Tuesday, May 30, 2023NOA E-MAILED - SOU REQUIRED FROM APPLICANT
Tuesday, November 28, 2023SOU EXTENSION 1 FILED
Tuesday, November 28, 2023SOU EXTENSION 1 GRANTED
Wednesday, November 29, 2023NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Tuesday, November 28, 2023SOU TEAS EXTENSION RECEIVED
Wednesday, February 7, 2024ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
Wednesday, February 7, 2024TEAS CHANGE OF OWNER ADDRESS RECEIVED
Wednesday, February 7, 2024TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
Wednesday, February 7, 2024TEAS CHANGE OF CORRESPONDENCE RECEIVED
Wednesday, February 7, 2024APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED
Tuesday, May 7, 2024TEAS CHANGE OF CORRESPONDENCE RECEIVED
Tuesday, May 7, 2024ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
Tuesday, May 7, 2024TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
Friday, May 24, 2024TEAS STATEMENT OF USE RECEIVED
Tuesday, July 2, 2024CASE ASSIGNED TO INTENT TO USE PARALEGAL
Wednesday, July 3, 2024STATEMENT OF USE PROCESSING COMPLETE
Friday, May 24, 2024USE AMENDMENT FILED
Tuesday, July 23, 2024NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED
Tuesday, August 27, 2024REGISTERED-PRINCIPAL REGISTER
Tuesday, August 27, 2024NOTICE OF REGISTRATION CONFIRMATION EMAILED
Tuesday, July 23, 2024ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED

Related Keywords

acuity wafer semiconductor equipment processing plated layer material cleanliness bevel seed