ACCRETECH Trademark

Trademark Overview


On Monday, January 22, 2001, a trademark application was filed for ACCRETECH with the United States Patent and Trademark Office. The USPTO has given the ACCRETECH trademark a serial number of 76198020. The federal status of this trademark filing is ABANDONED - NO STATEMENT OF USE FILED as of Saturday, September 17, 2005. This trademark is owned by Tokyo Seimitsu Co., Ltd.. The ACCRETECH trademark is filed in the Computer & Software Products & Electrical & Scientific Products and Construction & Repair Services categories with the following description:

Precision measuring machines, namely wafer thickness measuring machine, non-contact flatness measuring machine, digital length measuring machine, laser interference length measuring sensor, optical fiber laser interferometer measuring machine, surface texture measuring machine, three-dimensional measuring machine, surface texture and contour measuring machine, contour measuring machine, roundness measuring machine, roundness and cylindrical/flat profile analysis machine, coordinate measuring machine; data processing machines for use in processing coordinate measuring data, machine control gauge, displacement sensor, electric micrometer, pneumatic micrometer; computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors...

Repair and maintenance service for manufacturing and measuring apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length m...
accretech

General Information


Serial Number76198020
Word MarkACCRETECH
Filing DateMonday, January 22, 2001
Status606 - ABANDONED - NO STATEMENT OF USE FILED
Status DateSaturday, September 17, 2005
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing3000 - Illustration: Drawing or design which also includes word(s) / letter(s) / number(s)
Published for Opposition DateTuesday, June 24, 2003

Trademark Statements


Goods and ServicesPrecision measuring machines, namely wafer thickness measuring machine, non-contact flatness measuring machine, digital length measuring machine, laser interference length measuring sensor, optical fiber laser interferometer measuring machine, surface texture measuring machine, three-dimensional measuring machine, surface texture and contour measuring machine, contour measuring machine, roundness measuring machine, roundness and cylindrical/flat profile analysis machine, coordinate measuring machine; data processing machines for use in processing coordinate measuring data, machine control gauge, displacement sensor, electric micrometer, pneumatic micrometer; computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines and instruments and their parts and fittings, namely ultrasonic depth sounders; Automatic distribution vending machines; Network system comprised of computer hardware and software for wafer probing machines; Wafer inspection units
Goods and ServicesRepair and maintenance service for manufacturing and measuring apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; repair and maintenance of data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines
Lining/Stippling StatementThe stippling shown in the drawing is a feature of the mark.

Classification Information


International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code6 - Active
Class Status DateTuesday, February 6, 2001
Primary Code009
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class037 - Building construction; repair; installation services.
US Class Codes100, 103, 106
Class Status Code6 - Active
Class Status DateTuesday, February 6, 2001
Primary Code037
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameTokyo Seimitsu Co., Ltd.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressTokyo
JP

Party NameTokyo Seimitsu Co., Ltd.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressTokyo
JP

Trademark Events


Event DateEvent Description
Monday, November 21, 2005ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED
Monday, November 21, 2005ABANDONMENT - NO USE STATEMENT FILED
Saturday, April 9, 2005EXTENSION 3 GRANTED
Wednesday, March 16, 2005EXTENSION 3 FILED
Wednesday, March 16, 2005TEAS EXTENSION RECEIVED
Monday, September 20, 2004EXTENSION 2 GRANTED
Thursday, September 9, 2004EXTENSION 2 FILED
Thursday, September 9, 2004TEAS EXTENSION RECEIVED
Tuesday, August 17, 2004CASE FILE IN TICRS
Monday, April 26, 2004ASSIGNED TO EXAMINER
Thursday, March 25, 2004EXTENSION 1 GRANTED
Friday, March 12, 2004EXTENSION 1 FILED
Monday, March 15, 2004PAPER RECEIVED
Tuesday, September 16, 2003NOA MAILED - SOU REQUIRED FROM APPLICANT
Tuesday, June 24, 2003PUBLISHED FOR OPPOSITION
Wednesday, June 4, 2003NOTICE OF PUBLICATION
Saturday, April 12, 2003APPROVED FOR PUB - PRINCIPAL REGISTER
Tuesday, April 1, 2003FAX RECEIVED
Thursday, March 13, 2003NON-FINAL ACTION MAILED
Wednesday, March 12, 2003PREVIOUS ALLOWANCE COUNT WITHDRAWN
Monday, March 3, 2003APPROVED FOR PUB - PRINCIPAL REGISTER
Monday, January 13, 2003PAPER RECEIVED
Wednesday, January 8, 2003ASSIGNED TO EXAMINER
Wednesday, January 8, 2003PREVIOUS ALLOWANCE COUNT WITHDRAWN
Thursday, September 12, 2002APPROVED FOR PUB - PRINCIPAL REGISTER
Monday, July 15, 2002CORRESPONDENCE RECEIVED IN LAW OFFICE
Monday, July 15, 2002PAPER RECEIVED
Monday, February 11, 2002FINAL REFUSAL MAILED
Friday, November 9, 2001CORRESPONDENCE RECEIVED IN LAW OFFICE
Friday, May 11, 2001NON-FINAL ACTION MAILED
Tuesday, May 8, 2001ASSIGNED TO EXAMINER
Monday, April 30, 2001ASSIGNED TO EXAMINER