| Serial Number | 76182002 |
| Word Mark | ACCRETECH |
| Filing Date | Friday, December 15, 2000 |
| Status | 606 - ABANDONED - NO STATEMENT OF USE FILED |
| Status Date | Sunday, April 23, 2006 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 1000 - Typeset: Word(s) / letter(s) / number(s) |
| Published for Opposition Date | Tuesday, January 28, 2003 |
| Goods and Services | Brokerage of manufacturing and measuring apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines |
| Goods and Services | Repair and maintenance service for manufacturing and measuring apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines |
| Goods and Services | Rental of manufacturing apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Rental of measuring apparatus, namely-- Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines |
| International Class | 036 - Insurance; financial affairs; monetary affairs; real estate affairs. |
| US Class Codes | 100, 101, 102 |
| Class Status Code | 6 - Active |
| Class Status Date | Tuesday, January 2, 2001 |
| Primary Code | 036 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 037 - Building construction; repair; installation services. |
| US Class Codes | 100, 103, 106 |
| Class Status Code | 6 - Active |
| Class Status Date | Tuesday, January 2, 2001 |
| Primary Code | 037 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 040 - Treatment of materials. |
| US Class Codes | 100, 103, 106 |
| Class Status Code | 6 - Active |
| Class Status Date | Tuesday, January 2, 2001 |
| Primary Code | 040 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| Party Name | Kabushiki Kaisha Tokyo Seimitsu |
| Party Type | 20 - Owner at Publication |
| Legal Entity Type | 03 - Corporation |
| Address | Tokyo JP |
| Party Name | Kabushiki Kaisha Tokyo Seimitsu |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | Tokyo JP |
| Event Date | Event Description |
| Tuesday, June 27, 2006 | ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED |
| Tuesday, June 27, 2006 | ABANDONMENT - NO USE STATEMENT FILED |
| Thursday, September 8, 2005 | EXTENSION 5 GRANTED |
| Thursday, September 8, 2005 | EXTENSION 5 FILED |
| Thursday, September 8, 2005 | TEAS EXTENSION RECEIVED |
| Friday, March 18, 2005 | EXTENSION 4 GRANTED |
| Monday, February 28, 2005 | EXTENSION 4 FILED |
| Monday, February 28, 2005 | TEAS EXTENSION RECEIVED |
| Friday, October 29, 2004 | EXTENSION 3 GRANTED |
| Wednesday, October 20, 2004 | EXTENSION 3 FILED |
| Wednesday, October 20, 2004 | TEAS EXTENSION RECEIVED |
| Wednesday, August 11, 2004 | CASE FILE IN TICRS |
| Tuesday, May 4, 2004 | EXTENSION 2 GRANTED |
| Tuesday, April 20, 2004 | EXTENSION 2 FILED |
| Tuesday, May 4, 2004 | DIVISIONAL PROCESSING COMPLETE |
| Friday, April 23, 2004 | DIVISIONAL REQUEST RECEIVED |
| Monday, April 26, 2004 | ASSIGNED TO EXAMINER |
| Friday, April 23, 2004 | PAPER RECEIVED |
| Monday, November 10, 2003 | EXTENSION 1 GRANTED |
| Tuesday, October 14, 2003 | EXTENSION 1 FILED |
| Tuesday, October 14, 2003 | PAPER RECEIVED |
| Tuesday, April 22, 2003 | NOA MAILED - SOU REQUIRED FROM APPLICANT |
| Tuesday, January 28, 2003 | PUBLISHED FOR OPPOSITION |
| Wednesday, January 8, 2003 | NOTICE OF PUBLICATION |
| Monday, November 25, 2002 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Monday, July 15, 2002 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Monday, July 15, 2002 | PAPER RECEIVED |
| Tuesday, February 5, 2002 | FINAL REFUSAL MAILED |
| Thursday, October 11, 2001 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Wednesday, April 11, 2001 | NON-FINAL ACTION MAILED |
| Thursday, March 29, 2001 | ASSIGNED TO EXAMINER |