3.5 D Trademark

Trademark Overview


On Thursday, August 30, 2018, a trademark application was filed for 3.5 D with the United States Patent and Trademark Office. The USPTO has given the 3.5 D trademark a serial number of 79251467. The federal status of this trademark filing is REGISTERED as of Tuesday, July 7, 2020. This trademark is owned by Pac Tech - Packaging Technologies GmbH. The 3.5 D trademark is filed in the Metal Products, Machinery Products, Treatment & Processing of Materials Services, and Computer & Software Services & Scientific Services categories with the following description:

Common metals and their alloys, unwrought or semi-wrought; transportable buildings of metal; non-electric cables and wires of common metal; metal containers for storage and transport; contact metallizations for micro joints of soldering in the nature of solder pastes, soft solder films, foils, fluids and powder

Machines, machine tools and power tools for manufacturing of multifunctional-microelectromechanical and microoptoelectromechanical systems for the manufacture of transponders and semiconductor wafers and integrated circuits affixed thereto; bonding machines and bonding machine tools for assembly of electrical, mechanical and optical components for the manufacture of transponders, sensors and semiconductor wafers, and integrated circuits affixed thereto; machines, machine tools and power tools in the field of microperipheric technologies, namely, autogenous soldering machines, electric welding machines, gas welding machines, electric brazing machines, sintering machines for chemical processing, all for manufacturing micro and non-scale structures by the transformation of solder, welding, brazing, adhesive-bonding or sintering materials; machines, machine tools and power tools for applying connecting materials in form of pre-forms, pastes, films, foils, fluids or powder onto substrates b...

Treatment of materials by thermal, optical and mechanical interaction in relation to substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates, namely, optical radiation, laser radiation

Industrial analysis of goods or services of others to assure compliance with industry standards and scientific research services; design and development of computer hardware and software; product development in the field of contact pad metallizations for connection technology; development of new technology for others in the field of the manufacture of microconnections; technological consultancy, in the technology field of the manufacture of microconnections
3.5 d

General Information


Serial Number79251467
Word Mark3.5 D
Filing DateThursday, August 30, 2018
Status700 - REGISTERED
Status DateTuesday, July 7, 2020
Registration Number6092940
Registration DateTuesday, July 7, 2020
Mark Drawing4000 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, April 21, 2020

Trademark Statements


Goods and ServicesCommon metals and their alloys, unwrought or semi-wrought; transportable buildings of metal; non-electric cables and wires of common metal; metal containers for storage and transport; contact metallizations for micro joints of soldering in the nature of solder pastes, soft solder films, foils, fluids and powder
Goods and ServicesMachines, machine tools and power tools for manufacturing of multifunctional-microelectromechanical and microoptoelectromechanical systems for the manufacture of transponders and semiconductor wafers and integrated circuits affixed thereto; bonding machines and bonding machine tools for assembly of electrical, mechanical and optical components for the manufacture of transponders, sensors and semiconductor wafers, and integrated circuits affixed thereto; machines, machine tools and power tools in the field of microperipheric technologies, namely, autogenous soldering machines, electric welding machines, gas welding machines, electric brazing machines, sintering machines for chemical processing, all for manufacturing micro and non-scale structures by the transformation of solder, welding, brazing, adhesive-bonding or sintering materials; machines, machine tools and power tools for applying connecting materials in form of pre-forms, pastes, films, foils, fluids or powder onto substrates by using chemical, electro-chemical and physical deposition techniques, namely, machinery for applying coatings ultrasonically to medical and industrial apparatus; machines, machine tools and power tools for manufacturing microconnections, by chemical or physical deposition, mechanical-, thermal- or optical transformation; machines for electrical, optical and mechanical bonding to build up substrate units composed of one substrate or several substrates combined together to form a module, in particular chips; motors and engines, other than for land vehicles; machine couplings and transmission components, other than for land vehicles; devices in relation to micro-peripheral technologies, namely, machines for manufacture and processing of semi-conductors; apparatus, namely, electrostatic coating machines for applying connecting materials onto substrates, by using chemical, electro-chemical and physical deposition, dispense, placement and mechanical-, thermal- and optical transformation for manufacturing microconnections, in particular for building up substrate units composed of one substrate or several substrates combined together to form a module, in particular chips
Goods and ServicesTreatment of materials by thermal, optical and mechanical interaction in relation to substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates, namely, optical radiation, laser radiation
Goods and ServicesIndustrial analysis of goods or services of others to assure compliance with industry standards and scientific research services; design and development of computer hardware and software; product development in the field of contact pad metallizations for connection technology; development of new technology for others in the field of the manufacture of microconnections; technological consultancy, in the technology field of the manufacture of microconnections
Pseudo MarkTHREE . FIVE D

Classification Information


International Class006 - Common metals and their alloys; metal building materials; transportable buildings of metal; materials of metal for railway tracks; nonelectric cables and wires of common metal; ironmongery, small items of metal hardware; pipes and tubes of metal; safes; goods of common metal not included in other classes; ores.
US Class Codes002, 012, 013, 014, 023, 025, 050
Class Status Code6 - Active
Class Status DateTuesday, February 12, 2019
Primary Code006
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 031, 034, 035
Class Status Code6 - Active
Class Status DateTuesday, February 12, 2019
Primary Code007
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class040 - Treatment of materials.
US Class Codes100, 103, 106
Class Status Code6 - Active
Class Status DateTuesday, February 12, 2019
Primary Code040
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software.
US Class Codes100, 101
Class Status Code6 - Active
Class Status DateTuesday, February 12, 2019
Primary Code042
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NamePac Tech - Packaging Technologies GmbH
Party Type30 - Original Registrant
Legal Entity Type99 - Other
Address14641 Nauen
DE

Party NamePac Tech - Packaging Technologies GmbH
Party Type20 - Owner at Publication
Legal Entity Type99 - Other
Address14641 Nauen
DE

Party NamePac Tech - Packaging Technologies GmbH
Party Type10 - Original Applicant
Legal Entity Type99 - Other
Address14641 Nauen
DE

Trademark Events


Event DateEvent Description
Saturday, October 9, 2021NEW REPRESENTATIVE AT IB RECEIVED
Saturday, January 9, 2021FINAL DECISION TRANSACTION PROCESSED BY IB
Friday, October 30, 2020FINAL DISPOSITION NOTICE SENT TO IB
Friday, October 30, 2020FINAL DISPOSITION PROCESSED
Wednesday, October 7, 2020FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
Tuesday, July 7, 2020REGISTERED-PRINCIPAL REGISTER
Tuesday, April 21, 2020OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Tuesday, April 21, 2020PUBLISHED FOR OPPOSITION
Wednesday, April 1, 2020NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Friday, March 13, 2020APPROVED FOR PUB - PRINCIPAL REGISTER
Tuesday, March 10, 2020TEAS/EMAIL CORRESPONDENCE ENTERED
Monday, March 9, 2020CORRESPONDENCE RECEIVED IN LAW OFFICE
Monday, March 9, 2020TEAS REQUEST FOR RECONSIDERATION RECEIVED
Monday, September 16, 2019NOTIFICATION OF FINAL REFUSAL EMAILED
Monday, September 16, 2019FINAL REFUSAL E-MAILED
Monday, September 16, 2019FINAL REFUSAL WRITTEN
Tuesday, August 27, 2019TEAS/EMAIL CORRESPONDENCE ENTERED
Tuesday, August 27, 2019CORRESPONDENCE RECEIVED IN LAW OFFICE
Tuesday, August 27, 2019ASSIGNED TO LIE
Tuesday, August 20, 2019TEAS RESPONSE TO OFFICE ACTION RECEIVED
Saturday, March 16, 2019REFUSAL PROCESSED BY IB
Saturday, February 23, 2019NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
Saturday, February 23, 2019REFUSAL PROCESSED BY MPU
Saturday, February 16, 2019APPLICATION FILING RECEIPT MAILED
Friday, February 15, 2019NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
Thursday, February 14, 2019NON-FINAL ACTION WRITTEN
Tuesday, February 12, 2019ASSIGNED TO EXAMINER
Tuesday, February 12, 2019NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM
Thursday, February 7, 2019SN ASSIGNED FOR SECT 66A APPL FROM IB