2.5D CUBE-S Trademark of SAMSUNG ELECTRONICS CO., LTD. - Serial Number 99644854

2.5D CUBE-S Trademark

Trademark Overview

On Tuesday, February 10, 2026, a trademark application was filed for 2.5D CUBE-S with the United States Patent and Trademark Office. The USPTO has given the 2.5D CUBE-S trademark a serial number of 99644854. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Tuesday, February 10, 2026. This trademark is owned by SAMSUNG ELECTRONICS CO., LTD.. The 2.5D CUBE-S trademark is filed in the Computer & Software Products & Electrical & Scientific Products, Treatment & Processing of Materials Services, and Computer & Software Services & Scientific Services categories with the following description:

Semiconductor packaging platforms for integrating multiple semiconductor chips into a single package; Semiconductor packages, namely, semiconductor dies and interconnects; Multi-chip semiconductor packages; Semiconductor chips; Semiconductor wafers; Structured semiconductor wafers; Semiconductor substrates for semiconductor packaging; Semiconductor devices in the nature of substrates for semiconductor packaging, chips and circuit boards; Interposers for semiconductor packaging; Silicon bridges for semiconductor packaging; Semiconductor chip sets.

Etching of semiconductor wafers; Etching of integrated circuits; Semiconductor wafer-level processing; Wafer foundry services, namely, custom manufacture of semiconductor wafers for others; Custom manufacture of semiconductor packaging in the nature of semiconductor dies and interconnects, semiconductor chip housings and semiconductor integrated circuit modules; Integrated circuit packaging processing in the nature of manufacturing services for others; Semiconductor packaging processing in the nature of manufacturing services for others; Custom manufacture of semiconductor substrates for others; Substrate foundry services, namely, manufacturing of semiconductor substrates for others.

Technology research and development for others in the field of semiconductor-related products; Integrated circuit design services; Semiconductor packaging design services; Semiconductor substrate design services; Quality control inspection of semiconductors and semiconductor-related products; Testing of semiconductors and semiconductor-related products; Consulting services with respect to semiconductor packaging technology, namely, consulting regarding semiconductor packaging design and development; Design services for others in the field of semiconductor packaging; Consulting services in the field of semiconductor electromechanical engineering; Consulting services in the field of semiconductor packaging and semiconductor testing.

General Information

Serial Number	99644854
Word Mark	2.5D CUBE-S
Filing Date	Tuesday, February 10, 2026
Status	630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
Status Date	Tuesday, February 10, 2026
Registration Number	0000000
Registration Date	NOT AVAILABLE
Mark Drawing	4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition Date	NOT AVAILABLE

Trademark Statements

Goods and Services	Semiconductor packaging platforms for integrating multiple semiconductor chips into a single package; Semiconductor packages, namely, semiconductor dies and interconnects; Multi-chip semiconductor packages; Semiconductor chips; Semiconductor wafers; Structured semiconductor wafers; Semiconductor substrates for semiconductor packaging; Semiconductor devices in the nature of substrates for semiconductor packaging, chips and circuit boards; Interposers for semiconductor packaging; Silicon bridges for semiconductor packaging; Semiconductor chip sets.
Goods and Services	Etching of semiconductor wafers; Etching of integrated circuits; Semiconductor wafer-level processing; Wafer foundry services, namely, custom manufacture of semiconductor wafers for others; Custom manufacture of semiconductor packaging in the nature of semiconductor dies and interconnects, semiconductor chip housings and semiconductor integrated circuit modules; Integrated circuit packaging processing in the nature of manufacturing services for others; Semiconductor packaging processing in the nature of manufacturing services for others; Custom manufacture of semiconductor substrates for others; Substrate foundry services, namely, manufacturing of semiconductor substrates for others.
Goods and Services	Technology research and development for others in the field of semiconductor-related products; Integrated circuit design services; Semiconductor packaging design services; Semiconductor substrate design services; Quality control inspection of semiconductors and semiconductor-related products; Testing of semiconductors and semiconductor-related products; Consulting services with respect to semiconductor packaging technology, namely, consulting regarding semiconductor packaging design and development; Design services for others in the field of semiconductor packaging; Consulting services in the field of semiconductor electromechanical engineering; Consulting services in the field of semiconductor packaging and semiconductor testing.

Classification Information

International Class	009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes	021, 023, 026, 036, 038
Class Status Code	6 - Active
Class Status Date	Tuesday, February 10, 2026
Primary Code	009
First Use Anywhere Date	NOT AVAILABLE
First Use In Commerce Date	NOT AVAILABLE

International Class	040 - Treatment of materials.
US Class Codes	100, 103, 106
Class Status Code	6 - Active
Class Status Date	Tuesday, February 10, 2026
Primary Code	040
First Use Anywhere Date	NOT AVAILABLE
First Use In Commerce Date	NOT AVAILABLE

International Class	042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software.
US Class Codes	100, 101
Class Status Code	6 - Active
Class Status Date	Tuesday, February 10, 2026
Primary Code	042
First Use Anywhere Date	NOT AVAILABLE
First Use In Commerce Date	NOT AVAILABLE

Trademark Owner History

Party Name	SAMSUNG ELECTRONICS CO., LTD.
Party Type	10 - Original Applicant
Legal Entity Type	99 - Other
Address	Gyeonggi-do 16677 KR

Trademark Events

Event Date	Event Description
Tuesday, February 10, 2026	NEW APPLICATION ENTERED
Tuesday, February 10, 2026	APPLICATION FILING RECEIPT MAILED

Related Keywords

cube semiconductor packaging services others design field consulting circuit namely wafers