Μ - MATERIAL MACHINE Trademark

Trademark Overview


On Friday, September 20, 2024, a trademark application was filed for Μ - MATERIAL MACHINE with the United States Patent and Trademark Office. The USPTO has given the Μ - MATERIAL MACHINE trademark a serial number of 98761636. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Friday, September 20, 2024. This trademark is owned by Shin-Etsu Chemical Co., Ltd.. The Μ - MATERIAL MACHINE trademark is filed in the Machinery Products category with the following description:

Automatic electronic component mounting machines, namely, machines for automatically mounting IC chips or other electronic components to printed wired boards, and parts and accessories thereof; machines for mounting IC chips to circuit boards, and parts and accessories thereof; LED wafer processing equipment, and parts and accessories thereof; LED wafer treatment equipment, and parts and accessories thereof; LED chip transferring machines, and parts and accessories thereof; machines for automatically mounting LED chips to printed wired boards, and parts and accessories thereof; machines for mounting LED chips to circuit boards, and parts and accessories thereof; stamps and plates for use in manufacturing LED chips; LED chip manufacturing machines, and parts and accessories thereof; LED manufacturing machines, and parts and accessories thereof; wafer processing machines, and parts and accessories thereof; wafer treatment machines, and parts and accessories thereof; laser processing mach...

General Information


Serial Number98761636
Word MarkΜ - MATERIAL MACHINE
Filing DateFriday, September 20, 2024
Status630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
Status DateFriday, September 20, 2024
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Goods and ServicesAutomatic electronic component mounting machines, namely, machines for automatically mounting IC chips or other electronic components to printed wired boards, and parts and accessories thereof; machines for mounting IC chips to circuit boards, and parts and accessories thereof; LED wafer processing equipment, and parts and accessories thereof; LED wafer treatment equipment, and parts and accessories thereof; LED chip transferring machines, and parts and accessories thereof; machines for automatically mounting LED chips to printed wired boards, and parts and accessories thereof; machines for mounting LED chips to circuit boards, and parts and accessories thereof; stamps and plates for use in manufacturing LED chips; LED chip manufacturing machines, and parts and accessories thereof; LED manufacturing machines, and parts and accessories thereof; wafer processing machines, and parts and accessories thereof; wafer treatment machines, and parts and accessories thereof; laser processing machines and apparatus for glass processing, and parts and accessories thereof; glass processing machines and apparatus, and parts and accessories thereof; glassware manufacturing machines and apparatus; laser processing machines and apparatus for ceramic, and parts and accessories thereof; ceramic processing machines and apparatus, and parts and accessories thereof; chip transferring machines, and parts and accessories thereof; automatic electronic component mounting machines, namely, machines for automatically mounting chips to printed wired boards, and parts and accessories thereof; machines for mounting chips to circuit boards, and parts and accessories thereof; stamps and plates for use in manufacturing chips; chip manufacturing machines, and parts and accessories thereof; display manufacturing machines, and parts and accessories thereof; controllers for display manufacturing machines, and parts and accessories thereof; debonders, and parts and accessories thereof; plastic processing machines and apparatus, and parts and accessories thereof; laser processing machines for plastic processing, and parts and accessories thereof; exposure apparatus for use in display manufacturing, and parts and accessories thereof; laser processing machines for printed circuit board manufacturing, and parts and accessories thereof; processing machines for printed circuit board manufacturing, and parts and accessories thereof; bonders, and parts and accessories thereof; mass transfer equipment, and parts and accessories thereof; memory chip manufacturing machines, and parts and accessories thereof; lift equipment, and parts and accessories thereof; laser lift off equipment, and parts and accessories thereof; semiconductor manufacturing machines with laser, and parts and accessories thereof; printed circuit board manufacturing machines with laser, and parts and accessories thereof; device for marking objects with laser beam; laser welding machines; machines for debonding electronic components from boards by laser irradiating laminated components, and parts and accessories thereof; metalworking machines and tools, and parts and accessories thereof; laser processing machines for metalworking, and parts and accessories thereof; laminated semiconductor chip manufacturing machines, and parts and accessories thereof; electronic components feeding devices for use in manufacturing electronic circuit boards, and parts and accessories thereof; stamps and plates for use in manufacturing electronic components and micro computer chips; electronic components manufacturing machines, and parts and accessories thereof; semiconductor wafer processing equipment, and parts and accessories thereof; semiconductor wafer treatment equipment, and parts and accessories thereof; semiconductor chip transferring machines, and parts and accessories thereof; semiconductor substrate manufacturing machines, and parts and accessories thereof; jigs for semiconductor substrate, and parts and accessories thereof; jigs for boards of semiconductor manufacturing machines, and parts and accessories thereof; semiconductor manufacturing machines, and parts and accessories thereof; processing machines for semiconductor manufacturing, and parts and accessories thereof; laser processing machines for semiconductor manufacturing, and parts and accessories thereof; semiconductor manufacturing machines and apparatus, and parts and accessories thereof; thermal treating equipment for semiconductor manufacturing, and parts and accessories thereof; components mounting machines for semiconductor manufacturing, and parts and accessories thereof

Classification Information


International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 024, 031, 034, 035
Class Status Code6 - Active
Class Status DateFriday, September 20, 2024
Primary Code007
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameShin-Etsu Chemical Co., Ltd.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressTokyo 100-0005
JP

Trademark Events


Event DateEvent Description
Friday, September 20, 2024NEW APPLICATION ENTERED